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WORKS Monitoring von ASMPT

Active Stencil Storage von ASMPT

ASMPT präsentiert universelles Pick-and-Place-System DALA für alle Kameramodulkomponenten

Neue Analysefunktionen in SMT Analytics von ASMPT SMT Solutions

ASMPT SMT Solutions, ASYS Group und Rehm Thermal Systems setzen erfolgreiche Veranstaltungsreihe fort

ASMPT mit intelligenten Fertigungslösungen auf der APEX Expo 2026

Neue Bestückplattform von ASMPT SMT Solutions

ASMPT stellt optimiertes Odd Shaped Component (OSC) Package vor

ASMPT auf der productronica 2025

ASMPT auf der productronica 2025

Launch des ASMPT SMT Customer Portals

Intelligente Alternative-Bauelementelösung von ASMPT und Viscom für die Schaeffler AG

ASMPT stellt ALSI LASER1206 vor

WORKS Optimization von ASMPT

ASMPT Semiconductor Solutions auf der ECOC 2025

ASMPT stellt Multi-Chip-Bonder-Plattform MEGA vor

ASMPT erhält in der TechInsights-Umfrage 2025 weltweite Anerkennung für seinen herausragenden Kundenservice

ASMPT präsentiert Software-Duo für nahtlos automatisierte Materialflussoptimierung

ASMPT stellt Hochleistungs-Wire-Bonder AERO PRO vor

Toni Patzner übernimmt globale Leitung des Supply Chain Managements bei ASMPT SMT Solutions

ASMPT präsentiert zentrale Plattform zum Datenaustausch in der Elektronikfertigung

ASMPT präsentiert Die Bonder mit intelligenten Features

ASMPT Semiconductor Solutions auf der PCIM

ASMPT demonstriert Technologieführerschaft beim SMT-Bestückprozess

Dr. Thomas Marktscheffel von ASMPT für seine Verdienste um offene Schnittstellen ausgezeichnet

ASMPT auf der Optical Fiber Communication Conference (OFC) 2025

ASMPT Semiconductor Segment in Europa und Americas unter neuer Leitung mit Dr. Johann Weinhändler und Jean-Marc Peallat, PhD

Neue stationäre Kamera für SIPLACE Bestückautomaten

ASMPT präsentiert Hochleistungs-LED-Die-Bonder

Erfolgreicher Auftakt für das neue Eventformat von ASYS Group, ASMPT und Rehm Thermal Systems in Hamburg

Die Leiterplatte triggert den Programmdownload an der SMT-Linie

Multitalent: Panel-Level-Bestücklösung mit vielseitigen Einsatzmöglichkeiten – NUCLEUS XLplus von ASMPT

Backchannel-Produktionsplanung in der Elektronikfertigung

Innovatives Bonding für die Leistungselektronik

Hochflexibler Die- und Flip-Chip-Bonder für die Co-Packaged-Optics-Fertigung

Factory Material Manager von ASMPT

ASMPT auf der electronica 2024

Factory Equipment Center von ASMPT für die intelligente SMT-Fertigung

Höhere Erträge und Qualität bei der Wafer-Separation durch V-DOE-Mehrstrahl-Laser

ASMPT präsentiert zukunftsweisende Die-Bonding-Systeme für Co-Packaged Optics (CPO) auf der ECOC

WORKS Software Suite von ASMPT

ASMPT gewinnt zum zweiten Mal in Folge den exklusiven Texas Instruments Supplier Excellence Award

ASMPT ermöglicht hochfeste und -leitende Verbindungen mit Silbersintern

Paste Transfer und Quick Change Squeegees für ASMPT Printer

ASMPT erfolgreich auf PCIM Europe

ASMPT kombiniert Highspeed Chip Assembly direkt vom Wafer mit SMT-Bestückung

ASMPT auf der PCIM Europe, Nürnberg, 11. – 13. Juni 2024, Halle 6, Stand 6-450

Automatischer Programmwechsel in der Intelligent Factory

ASMPT optimiert den ganzheitlichen Materialfluss in der Intelligent Factory

Tiefenanalyse in der SMT-Fertigung

ASMPT im Semiconductor Climate Consortium

Die-Bonder AMICRA NOVA Pro von ASMPT

Stark im Team: Process Lens und WORKS Process Expert von ASMPT

ASMPT launcht Hochgeschwindigkeits-Kameraproduktionssystem CMAT-S

SIPLACE TX micron von ASMPT vereint SMT-Bestückung und Die-Verarbeitung

ASMPT zieht positive Bilanz zur productronica 2023

ASMPT Semiconductor Assembly und Packaging auf der productronica

ASMPT auf der productronica 2023

ASMPT auf der NEPCON China 2023

Factory Equipment Center von ASMPT bringt Produktions- und Wartungsplanung in Einklang

ASMPT SMT Solutions stellt strategische Weichen für weiteren Geschäftserfolg

Smartes Arbeiten in SMT-Fertigungen

ASMPT Semiconductor auf der PCIM 2023

Expertensystem von ASMPT entlastet Prozessingenieure und Mitarbeitende in der Qualitätssicherung – jetzt auch offen für Drittanbieter

ASMPT SEMI Solutions Segment: Mit neuer Führung weiter auf Erfolgskurs

ASMPT setzt auf Kontinuität: Mit Wechsel in globaler und SMT-Führung weiter auf Erfolgskurs

Kooperation zwischen ASMPT und cts

Lösungen für die End-of-Line-Fertigung von ASMPT

WORKS Material Demand Calculation von ASMPT

Näher am Kunden und mehr Resilienz gegen Supply-Chain-Störungen

ASMPT stellt Expertensystem Virtual Assist vor

Open Automation in der Integrated Smart Factory

ASMPT Semiconductor Solutions auf der electronica 2022

ASMPT Semiconductor Solutions auf der electronica 2022

Neuer Lotpastendrucker von ASMPT bringt mehr Flexibilität

Alle Einheiten weltweit unter der Marke ASMPT zusammengefasst

English

ASMPT Joins "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

ASMPT introduces AERO PRO high-performance wire bonder

ASMPT presents die bonder with intelligent features

ASMPT Semiconductor Solutions at PCIM

ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)

ASMPT Semiconductor Solutions under new management in Europe and Americas with Dr. Johann Weinhändler and Jean-Marc Peallat, PhD

ASMPT presents high-performance LED die bonder

ASMPT presents high-performance LED die bonder

Versatile Performer: Panel Level Pick & Place Solution with Multi-Purpose Capabilities – NUCLEUS XLplus from ASMPT

Versatile Performer: Panel Level Pick & Place Solution with Multi-Purpose Capabilities – NUCLEUS XLplus from ASMPT

Innovative bonding for power electronics

Innovative bonding for power electronics

Katie Xu Promoted to Executive Vice President

Highly flexible die and flip-chip bonder for co-packaged optics production

Highly flexible die and flip-chip bonder for co-packaged optics production

ASMPT at Electronica 2024

ASMPT at Electronica 2024

Greater yields and improved quality in wafer separation with the V-DOE multibeam laser

Greater yields and improved quality in wafer separation with the V-DOE multibeam laser

ASMPT presents leading-edge die bonding systems for Co-Packaged Optics (CPO) at ECOC

ASMPT and TATA Electronics Private Limited announce a strategic partnership

Meeting ASMPT at SEMICON India 2024

ASMPT at SEMICON Taiwan 2024

ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running

ASMPT makes high-strength and high-conductivity joints possible with silver sintering

ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

ASMPT successful at PCIM Europe

ASMPT at AutoSens USA, Detroit, May 21-23, 2024, Booth 262

ASMPT at PCIM Europe, Nuremberg, June 11–13, 2024, Hall 6, Booth 6-450

ASMPT at IPC APEX EXPO 2024 from April 9 to 11

AMICRA NOVA Pro from ASMPT

ASMPT launches CMAT-S high-speed camera production system

ASMPT is upbeat on the results of productronica 2023

ASMPT semiconductor assembly and packaging at the Productronica trade fair

ASMPT Semiconductor at PCIM 2023

ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future

ASMPT announces key global and SMT leadership changes to prepare it for the future

ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future

ASMPT announces key global and SMT leadership changes to prepare it for the future

ASMPT Announces 2022 Annual Results

Closer to the customer and more resilience against supply chain disruptions

ASMPT and SMarTsol celebrate grand opening of new training facility in Querétaro, Mexico

English - Asia

ASMPT at SEMICON Southeast Asia 2026

ASMPT SMT Solutions at Productronica India 2026

WORKS Monitoring from ASMPT

Active Stencil Storage from ASMPT

ASMPT introduces pick & place system DALA for all camera module components

New analytics functions in SMT Analytics from ASMPT SMT Solutions

ASMPT at SEMICON Korea

ASMPT to show intelligent manufacturing solutions at APEX EXPO 2026

New placement platform from ASMPT SMT Solutions

ASMPT SMT Solutions and Shinwa launch cooperation at NEPCON Japan 2026

ASMPT SEMI Solutions exhibits at NEPCON Japan

ASMPT presents optimized Odd Shaped Component (OSC) Package

ASMPT at Productronica 2025

ASMPT at Productronica 2025

Launch of the ASMPT SMT Customer Portal

ASMPT at productronica India

ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology

Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG

ASMPT at SEMICON West 2025

ASMPT introduces ALSI LASER1206

ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions

ASMPT exhibits at SEMICON Taiwan

WORKS Optimization from ASMPT

ASMPT exhibits at SEMICON India

ASMPT Announces Strategic Optimisation of its Manufacturing Operations

ASMPT introduces MEGA multi-chip bonding platform

ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey

ASMPT presents software duo for seamlessly automated material flow optimization

ASMPT at NEPCON Thailand

Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions

ASMPT at NEPCON Thailand

ASMPT presents central platform for data exchange in electronics manufacturing

ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise

ASMPT demonstrates technology leadership in SMT assembly

Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces

New stationary camera for SIPLACE placement machines

New Managing Director at ASMPT SMT Solutions for the Asia region (excluding China)

ASMPT: Great Success at SEMICON Korea 2025

ASMPT at SEMICON Korea 2025

PCBs trigger program downloads on the SMT line

Backchannel production planning in electronics manufacturing with WORKS

Factory Material Manager from ASMPT

Factory Equipment Center from ASMPT for intelligent SMT production

WORKS Software Suite from ASMPT

ASMPT Philippines at PSECE 2024

Automatic Paste Transfer and Quick Change Squeegee for ASMPT printers

ASMPT at NEPCON China 2024 from April 24 to 26

Automatic program change in the intelligent factory

ASMPT streamlines the entire material flow in the intelligent factory

In-depth analyses in SMT production

ASMPT in the Semiconductor Climate Consortium

A strong team: Process Lens and WORKS Process Expert from ASMPT

SIPLACE TX micron from ASMPT combines SMT assembly and die processing

ASMPT at productronica 2023

ASMPT at Productronica India

ASMPT at the Advanced Semiconductor Packaging Show (ASPS) in South Korea

ASMPT at Nepcon China 2023

Factory Equipment Center from ASMPT brings production and maintenance planning in line

ASMPT SMT Solutions sets strategic course for continued business success

Smart working in SMT factories

ASMPT combines high-speed chip assembly directly from wafers with SMT placement in a single machine

ASMPT’s expert system provides relief for quality assurance staff – now also open to third-party equipment

End-of-line manufacturing solutions from ASMPT

ASMPT successful at INTERNEPCON JAPAN

ASMPT at SEMICON KOREA 2023

WORKS Material Demand Calculation from ASMPT

Enabling the digital world

New solder paste printer from ASMPT delivers more flexibility

Leading semiconductor & electronics equipment maker aligns all units globally under ‘ASMPT’ brand

English - China

WORKS Monitoring from ASMPT

Active Stencil Storage from ASMPT

New analytics functions in SMT Analytics from ASMPT SMT Solutions

ASMPT to show intelligent manufacturing solutions at APEX EXPO 2026

New placement platform from ASMPT SMT Solutions

ASMPT SMT Solutions and Shinwa launch cooperation at NEPCON Japan 2026

ASMPT presents optimized Odd Shaped Component (OSC) Package

ASMPT at Productronica 2025

ASMPT at Productronica 2025

Launch of the ASMPT SMT Customer Portal

Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG

WORKS Optimization from ASMPT

ASMPT presents software duo for seamlessly automated material flow optimization

Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions

ASMPT presents central platform for data exchange in electronics manufacturing

ASMPT demonstrates technology leadership in SMT assembly

Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces

New stationary camera for SIPLACE placement machines

PCBs trigger program downloads on the SMT line

Backchannel production planning in electronics manufacturing with WORKS

Factory Material Manager from ASMPT

Factory Equipment Center from ASMPT for intelligent SMT production

WORKS Software Suite from ASMPT

ASMPT Philippines at PSECE 2024

Automatic Paste Transfer and Quick Change Squeegee for ASMPT printers

ASMPT at NEPCON China 2024 from April 24 to 26

Automatic program change in the intelligent factory

ASMPT streamlines the entire material flow in the intelligent factory

In-depth analyses in SMT production

ASMPT in the Semiconductor Climate Consortium

A strong team: Process Lens and WORKS Process Expert from ASMPT

SIPLACE TX micron from ASMPT combines SMT assembly and die processing

ASMPT at productronica 2023

ASMPT at Productronica India

ASMPT at Nepcon China 2023

Factory Equipment Center from ASMPT brings production and maintenance planning in line

ASMPT SMT Solutions sets strategic course for continued business success

Smart working in SMT factories

ASMPT combines high-speed chip assembly directly from wafers with SMT placement in a single machine

ASMPT’s expert system provides relief for quality assurance staff – now also open to third-party equipment

End-of-line manufacturing solutions from ASMPT

ASMPT at SEMICON KOREA 2023

WORKS Material Demand Calculation from ASMPT

New solder paste printer from ASMPT delivers more flexibility

Leading semiconductor & electronics equipment maker aligns all units globally under ‘ASMPT’ brand

English - EU

WORKS Monitoring from ASMPT

Active Stencil Storage from ASMPT

ASMPT introduces universal pick & place system DALA for all camera module components

New analytics functions in SMT Analytics from ASMPT SMT Solutions

ASMPT to show intelligent manufacturing solutions at APEX EXPO 2026

New placement platform from ASMPT SMT Solutions

ASMPT presents optimized Odd Shaped Component (OSC) Package

ASMPT at Productronica 2025

ASMPT at Productronica 2025

Launch of the ASMPT SMT Customer Portal

ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology

Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG

ASMPT introduces ALSI LASER1206

ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions

ASMPT exhibits at SEMICON Taiwan

WORKS Optimization from ASMPT

ASMPT Semiconductor Solutions at ECOC 2025

ASMPT introduces MEGA multi-chip bonding platform

ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey

ASMPT presents software duo for seamlessly automated material flow optimization

ASMPT introduces AERO PRO high-performance wire bonder

Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions

ASMPT presents central platform for data exchange in electronics manufacturing

ASMPT presents die bonder with intelligent features

ASMPT demonstrates technology leadership in SMT assembly

Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces

ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)

ASMPT Semiconductor Solutions under new management in Europe and Americas with Dr. Johann Weinhändler and Jean-Marc Peallat, PhD

New stationary camera for SIPLACE placement machines

PCBs trigger program downloads on the SMT line

Backchannel production planning in electronics manufacturing with WORKS

Factory Material Manager from ASMPT

Factory Equipment Center from ASMPT for intelligent SMT production

WORKS Software Suite from ASMPT

Automatic Paste Transfer and Quick Change Squeegee for ASMPT printers

ASMPT combines high-speed chip assembly directly from the wafer with SMT placement in a single machine

Automatic program change in the intelligent factory

ASMPT streamlines the entire material flow in the intelligent factory

In-depth analyses in SMT production

ASMPT in the Semiconductor Climate Consortium

A strong team: Process Lens and WORKS Process Expert from ASMPT

SIPLACE TX micron from ASMPT combines SMT assembly and die processing

ASMPT at productronica 2023

ASMPT at Nepcon China 2023

Factory Equipment Center from ASMPT brings production and maintenance planning in line

ASMPT SMT Solutions sets strategic course for continued business success

Smart working in SMT factories

ASMPT’s expert system provides relief for quality assurance staff – now also open to third-party equipment

ASMPT and cts agree on cooperation

End-of-line manufacturing solutions from ASMPT

WORKS Material Demand Calculation from ASMPT

ASMPT presents Virtual Assist expert system

Open Automation in the integrated smart factory

ASMPT Semiconductor Solutions at Electronica 2022

Sound technology innovator selects SIPLACE SX platform to increase production capacity, enable flexibility and facilitate high-changeover, multi-product manufacturing

ASMPT Semiconductor Solutions at Electronica 2022

New solder paste printer from ASMPT delivers more flexibility

Leading semiconductor & electronics equipment maker aligns all units globally under ‘ASMPT’ brand

English - US

ASMPT SMT Solutions continues to expand its sales and service organization in the U.S. market

WORKS Monitoring from ASMPT

Active Stencil Storage from ASMPT

ASMPT looking back on a successful APEX EXPO 2026

ASMPT introduces pick & place system DALA for all camera module components

ASMPT at OFC 2026 Los Angeles

New analytics functions in SMT Analytics from ASMPT SMT Solutions

ASMPT to show intelligent manufacturing solutions at APEX EXPO 2026

New placement platform from ASMPT SMT Solutions

ASMPT presents optimized Odd Shaped Component (OSC) Package

ASMPT at Productronica 2025

ASMPT at Productronica 2025

Launch of the ASMPT SMT Customer Portal

ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology

Intelligent alternative-component solution from ASMPT and Viscom for Schaeffler AG

ASMPT at SEMICON West 2025

ASMPT introduces ALSI LASER1206

ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions

ASMPT exhibits at SEMICON Taiwan

WORKS Optimization from ASMPT

ASMPT introduces MEGA multi-chip bonding platform

ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey

ASMPT presents software duo for seamlessly automated material flow optimization

ASMPT introduces AERO PRO high-performance wire bonder

Toni Patzner becomes Global Head of Supply Chain Management at ASMPT SMT Solutions

ASMPT presents central platform for data exchange in electronics manufacturing

ASMPT presents die bonder with intelligent features

ASMPT at SEMICON SEA showcases comprehensive advanced packaging expertise

ASMPT demonstrates technology leadership in SMT assembly

Dr. Thomas Marktscheffel of ASMPT honored for his work on open interfaces

New stationary camera for SIPLACE placement machines

ASMPT at IPC APEX EXPO 2025

PCBs trigger program downloads on the SMT line

Backchannel production planning in electronics manufacturing with WORKS

Factory Material Manager from ASMPT

Factory Equipment Center from ASMPT for intelligent SMT production

WORKS Software Suite from ASMPT

Brazil Technology Days

Automatic Paste Transfer and Quick Change Squeegee for ASMPT printers

ASMPT combines high-speed chip assembly directly from the wafer with SMT placement in a single machine

Reorganization of the ASMPT SMT Solutions segment in North and South America

ASMPT at IPC APEX EXPO 2024 from April 9 to 11

Automatic program change in the intelligent factory

ASMPT streamlines the entire material flow in the intelligent factory

In-depth analyses in SMT production

ASMPT in the Semiconductor Climate Consortium

Engaged attendees seek to improve efficiency and yield, secure competitiveness within North American market

A strong team: Process Lens and WORKS Process Expert from ASMPT

Ramon Hernandez joins ASMPT team

SIPLACE TX micron from ASMPT combines SMT assembly and die processing

ASMPT at productronica 2023

New stencil printing platform impresses with non-stop production capabilities, robust design, and production speed

Open automation, WORKS software portfolio, and powerhouse equipment on display at premier South American electronics exhibition

ASMPT at Nepcon China 2023

Factory Equipment Center from ASMPT brings production and maintenance planning in line

ASMPT SMT Solutions sets strategic course for continued business success

Smart working in SMT factories

ASMPT’s expert system provides relief for quality assurance staff – now also open to third-party equipment

End-of-line manufacturing solutions from ASMPT

ASMPT begins the year with impressive showing at APEX 2023

ASMPT at SEMICON KOREA 2023

WORKS Material Demand Calculation from ASMPT

ASMPT presents Virtual Assist expert system

Open Automation in the integrated smart factory

Sound technology innovator selects SIPLACE SX platform to increase production capacity, enable flexibility and facilitate high-changeover, multi-product manufacturing

New solder paste printer from ASMPT delivers more flexibility

Leading semiconductor & electronics equipment maker aligns all units globally under ‘ASMPT’ brand