ALSI LASER1206, the fully automated laser dicing and grooving solution from ASMPT.

As a multi-chip bonding solution, the MEGA perfectly meets the requirements of the next generation of smart chips, for example for advanced driver-assistance systems (ADAS).

SilverSAM PRO, a next-generation sintering platform, particularly suitable for power modules in the powertrain of electric vehicles and in fast-charging infrastructure.