Lim Choon Khoon, Senior Vice President and Chief Counsel for Advanced Packaging, ASMPT SEMI, speaking at SEMICON SEA 2026

The advanced packaging technology of the SIPLACE TX micron assembles dies, bare semiconductor chips, as well as classic SMT components.

The award-winning SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.