The new SIPLACE V platform handles the entire range of components – from ultra-small 016008M chips to large-format components – and really shines when dealing with challenging or odd-shaped components.

The TWIN VHF (Very High Force) placement head is designed to handle large AI processor BGAs.

With its three DEK TQ, DEK TQ L and DEK TQ XL models, the DEK TQ platform covers the complete product spectrum in electronics manufacturing.

The SIPLACE CA2 eliminates costly die-taping steps and adds greater flexibility to advanced packaging production.

Virtual Assist puts expert knowledge at operators’ fingertips, helping them solve problems faster and reduce service and maintenance effort.