Johnny Fan, General Manager, Country Head & Head of Sales, ASMPT Semiconductor Solutions Taiwan, driving customer engagement and supporting the advancement of Taiwan's semiconductor ecosystem.

ASMPT's MEGA multi-chip bonding solution combines ±2 μm placement accuracy and ±0.1° alignment accuracy with integrated dispensing, UV fixation and inspection capabilities to support advanced packaging, silicon photonics and Co-Packaged Optics (CPO) applications.