The SIPLACE CA2 revolutionizes the production of SiPs by combining the processing of SMDs and dies directly from the wafer in a single machine with maximum speed and precision.

Component tacking with POWER VECTOR: Multi-chip bonding for die sizes from 0.5 mm to 16 mm or even bigger on request.

CamSpector Pro is the world’s first sub-micron AOI system combined with a foreign materials (FM) cleaner.