Jean-Marc Peallat, PhD, Regional Head ASMPT Semiconductor Solutions Americas
FIREBIRD Series – enable advanced tech node semiconductor device for HPC data center
LITHOBOLT™ G2 – ultra-high precision die bonder for die-to-wafer (D2W) bonding
HighTech communications GmbH Brunhamstraße 21 (Geb. 202 / 2. OG) 81249 München Deutschland
Barbara Ostermeier Peter Kronfeld
Telefon: +49 89 500778-0 Telefax: +49 89 500778-78 E-Mail: info@htcm.de
Handelsregister: München, HRB 145144 Amtsgericht: München USt-Id.Nr.: DE813582985
Press release as Microsoft® Word Document (English)
