Würth Elektronik

Würth Elektronik

An application for WE-TGFG: The power loss of the IC component is conducted laterally to a heat sink through the graphite gasket.

Source: Würth Elektronik

WE-TGF silicone pads close gaps and allow heat to dissipate.

Source: Würth Elektronik

With custom profiles, the WE-TGFG can interface non-planar contact surfaces

Source: Würth Elektronik