The MEGA’s customizable options meet the packaging requirements of sophisticated multi-chip components, making it the bonder of choice for optical transceivers, photonics, sensors, and other highly advanced applications.

AMICRA NANO was the first bonding solutions in the industry to achieve a placement accuracy of< ± 0.2 μm at 3 sigma.

AMICRA NOVA combines high placement accuracy with short cycle times and innovative bonding technologies.