As a multi-chip bonding solution, the MEGA perfectly meets the requirements for the next generation of server clusters and AI edge devices, such as smartphones, data, and telecommunication applications.

DALA, universal pick-and-place system for camera-module assembly, handling all components—from die and lens holder attachment to glass bonding—with high precision and flexibility for efficient imaging and sensing system production.

ALSI LASER1206, the fully automatic laser dicing and grooving system, provides an ideal platform for advanced packaging and power automotive applications.

The advanced packaging technology of the SIPLACE TX micron assembles dies, bare semiconductor chips, as well as classic SMT components.

The award-winning SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.