The MEGA-P chip bonder features high flexibility and a modular design while taking up little space (2,550 × 2,085 × 1970 mm or 100.4 × 82 ×77.6 inches).

The AMICRA NANO high-precision die and flip-chip bonder was specially designed for the production of co-packaged optics and features a placement accuracy of ±0.2 µm @ 3 σ. ± 0.2 μm at 3 σ.

The AMICRA NOVA Pro meets the growing demand for die-bond- and flip-chip-capable machines with high throughput (UPH1000) and maximum precision in the 1-micron range.