MEGA – Revolutionizing multi-chip packaging with precision and efficiency

DALA – universal Pick & Place system for all camera module components

SilverSAM™ – sintering platform with an oxidation-free, copper-friendly environment for high-throughput of power modules

LITHOBOLT^® – ultra-high precision die bonder for die to wafer (D2W) hybrid bonding

FIREBIRD Series – enable advanced tech node semiconductor device for HPC data centre

Dr Gary Widdowson, Chief Technology Officer at ASMPT Semiconductor Solutions