ALSI LASER1206, the fully automatic laser dicing and grooving system from ASMPT.

The ALSI LASER1206 Pre-Alignment Station detects wafer notches and flats and precisely aligns the wafer for the subsequent laser dicing or grooving process.

The integrated Coating and Cleaning Station of the ALSI LASER1206 enables precise application of protective coatings and reliable removal of particles and residues – ensuring optimal wafer quality and maximum yield.

The fully automated ALSI LASER1206 system employs patented multi-beam UV laser technology for high-precision wafer dicing and grooving with minimal heat impact – ideally suited for Si, SiC, GaN and other advanced semiconductor materials.