Leading-edge technology at OFC: The AMICRA NANO high-precision die and flip-chip bonder was specially designed for the production of co-packaged optics and features a placement accuracy of ±0.2 μm @ 3 σ.

AMICRA NOVA Pro meets the growing demand for die-bond- and flip-chip-capable machines with high throughput (1,000 UPH) and maximum precision in the 1 μm range.

As a die bonder for high-performance computing chips, MEGA perfectly meets the requirements for the next generation of server clusters and AI edge devices such as smartphones and advanced driver assistance systems (ADAS), as well as data and telecommunication applications.