The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.

AERO PRO: next-level wire bonding

MEGA: high-precision IC bonding for advanced computing

DALA: universal pick & place system for camera module assembly

SMT Analytics: Material analysis with the Reject Analysis use case

Factory Equipment Center: Each SmartNozzle has its own ID with which it can be scanned and evaluated – whether it is in use or, as shown here, in the Nozzle Cleaning Station.

Thanks to NLP technology, users can ask Virtual Assist questions just like a human colleague.

The showcased SIPLACE CA2 hybrid placement platform was one of the key attractions at the ASMPT booth.

The well-attended ASMPT booth offered numerous opportunities for networking and professional dialogue.

Visitors to the booth also showed great interest in ASMPT's portfolio of software solutions for the intelligent factory.