The AMICRA NANO high-precision die and flip-chip bonder was specifically designed for the production of co-packaged optics and features a placement accuracy of ± 0.2 µm @ 3 σ.

The versatile SilverSAM sintering platform provides an oxidation-free, copper-friendly environment for the production of power modules and can handle various substrate formats.

Dr. Johann Weinhändler, Managing Director at ASMPT AMICRA GmbH in Regensburg, is responsible for ASMPT’s Semiconductor Solutions segment in EMEA.