Engineered to meet SEMI3D20 standards, NUCLEUS XLplus is poised to play a crucial role in enabling the next generation of AI-powered devices.

Coupled with ASMPT’s SiC power solution, POWER VECTOR is the ideal module bonding platform for high-performance automotive power module production lines.

VORTEX II, the high-performance LED die bonder for ultra-fine pitch direct view displays, revolutionizing visual experiences in modern vehicles.