SilverSAM silver sintering machine: Enabling high power density connections for power modules.
The LASER1205 UVP laser separation technology, addressing the roadmap of power semiconductors.
HighTech communications GmbH Brunhamstraße 21 (Geb. 202 / 2. OG) 81249 München Deutschland
Barbara Ostermeier Peter Kronfeld
Telefon: +49 89 500778-0 Telefax: +49 89 500778-78 E-Mail: info@htcm.de
Handelsregister: München, HRB 145144 Amtsgericht: München USt-Id.Nr.: DE813582985
Press release as Microsoft® Word Document (English)
