Live at the booth: The DEK TQ and DEL TQ L solder paste printers with their new Automated Paste Transfer and Quick Change Squeegee functions.

SIPLACE placement systems equipped with the TWIN Very High Force head and the latest software can securely handle larger, heavier components and feature state-of-the-art vision and inspection capabilities for both the component and the board.

Most large, modern BGAs have multiple bare dies and passive components inside.

A strong pair: Factory Material Manager and WORKS Logistics ensure the seamlessly automated flow of materials in the entire factory.