With a newly developed SIPLACE placement platform and a new DEK solder paste printer, ASMPT presents real game changers for the intelligent factory.

The hybrid SIPLACE CA2 places SMDs and dies directly off the wafer for advanced packaging applications in high-volume lines.

As an automatic high precision multi-chip die bonder for diverse multi-chip packages, the MEGA perfectly meets the requirements for the next generation of server clusters and AI edge devices such as smartphones and advanced driver assistance systems (ADAS), as well as data and telecommunication applications.

The AMICRA NANO precision bonder was specifically designed for the production of co-packaged optics and features a ultra-precision placement accuracy of ± 0.2 µm @ 3 σ.