AERO PRO, innovative wire bonding solution for high-end IC contacting
The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.
HighTech communications GmbH Brunhamstraße 21 (Geb. 202 / 2. OG) 81249 München Deutschland
Barbara Ostermeier Peter Kronfeld
Telefon: +49 89 500778-0 Telefax: +49 89 500778-78 E-Mail: info@htcm.de
Handelsregister: München, HRB 145144 Amtsgericht: München USt-Id.Nr.: DE813582985
Press release as Microsoft® Word Document (English)
