The AMICRA NANO high-precision die and flip-chip bonder was specifically designed for the production of co-packaged optics and features a placement accuracy of ± 0.2 µm @ 3 σ.
Image source: ASMPT
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HighTech communications GmbH
Brunhamstraße 21 (Geb. 202 / 2. OG)
81249 München
Deutschland
Press release as Microsoft® Word Document (English)