The AMICRA NOVA Pro meets the growing demand for die-bond- and flip-chip-capable machines with high throughput (UPH1000) and maximum accuracy in the 1-micron range.
Image source: ASMPT
Impressum & Kontakt
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HighTech communications GmbH
Brunhamstraße 21 (Geb. 202 / 2. OG)
81249 München
Deutschland
Press release as Microsoft® Word Document (English)