AMICRA NOVA Pro meets the growing demand for die-bond and flip-chip capable machines with high throughput (UPH1000) and highest highest accuracy in the 1μm range.

The CMAT-S complete system mounts and dynamically aligns lenses in ADAS cameras with unprecedented throughput.

The Eagle AERO high-end wire bonder for the highest pin densities has intelligent monitoring and quality assurance in real time.

The focus of ASMPT Semiconductor Solutions' presence at productronica is on "Smart Automotive Solutions" with solutions for ADAS, Connectivity and Electrification.