The ASMPT booth at the INTERNEPCON JAPAN attracted many industry visitors and decision makers.
A look under the hood: The XFINITE epoxy die bonder at the ASMPT booth.
0201m demo board under the video microscope: ASMPT presented new technologies for the automotive sector.
Yuzo Ishizaki, General Manager at ASMPT SMT Japan
Press release as Microsoft® Word Document (English)
