The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.

Interior view of the SIPLACE CA2: The placement machine can simultaneously process classic 8-millimeter SMT tapes as well as dies directly off the sawn wafer.

A sawn wafer gets fed from the wafer exchange unit into the multi-wafer system. The wafer swap takes only 10 seconds.

The Wafer Exchange Unit is extremely flexible and can process up to 50 different wafers.

Strong duo for SiP production: SIPLACE TX micron & SIPLACE CA2