The SIPLACE CA2 boosts productivity in advanced packaging by combining classic SMT with die-attach and flip-chip assembly.

Interior view of the SIPLACE CA2: The placement machine can simultaneously process classic 8-millimeter tapes as well as dies directly from the wafer.

A sawed wafer gets fed from the wafer exchange unit into the multi-wafer system. The wafer swap takes only 6.5 seconds.

The SIPLACE CA2 delivers maximum performance and flexibility in a footprint of only 2.56 × 2.50 meters.