With its placement accuracy of ±0.2 μm at 3 σ, the AMICRA NANO is equipped to carry out all die-attach and flip-chip bonding tasks.
ASMPT Eagle AERO – The new standard for flexibility and process stability with a precision of 2 µm @ 3 σ for substrates measuring up to 105 by 300 millimeters.
Press release as Microsoft® Word Document (English)
