With a footprint of just 1.1 × 2.4 meters, the new SIPLACE V gives electronics manufacturing a decisive boost – not only in real performance, but also in quality, flexibility, and future readiness.

The new SIPLACE V platform processes the entire component spectrum – from ultra-small 016008M chips to large-format parts – and proves its strengths especially with challenging or unusually shaped components.

With its three DEK TQ, DEK TQ L and DEK TQ XL models, the DEK TQ XL platform covers the complete product spectrum in electronics manufacturing.

The optimized OSC package can process components measuring up to 200 x 150 mm and weighing up to 500 g