With a footprint of just 1.1 × 2.4 meters, the new SIPLACE V gives electronics manufacturing a decisive boost – not only in real performance, but also in quality, flexibility, and future readiness.

The new SIPLACE V platform processes the entire component spectrum – from ultra-small 016008M chips to large-format parts – and proves its strengths especially with challenging or unusually shaped components.

45 available 8 mm slots per location – constant, regardless of the selected options. All existing X-Feeders remain fully compatible, including the Linear Dipping Unit, Power Connector, as well as the SIPLACE Glue Feeder and SIPLACE Measuring Feeder.

The new CP20 collect-and-place head has been specifically optimized for maximum performance and precision – delivering up to 52,500 cph at 25 µm @ 3σ, it sets new standards for high-speed applications in electronics manufacturing.