AOR TCB with FIREBIRD Series, Next evolution of IC interconnect solutions for heterogeneous integration

ALSI LASER1206, the fully automatic laser dicing and grooving system.

AMICRA NANO, Ultra-precision placement for co-packaged optics assembly

NEXX Stratus™ P500, Advanced electroplating for dense IC packages

The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly.