AMICRA NANO is an ultra-precision die and flip-chip bonder (±0.3µm@3s ) for highly demanding assembly tasks and is the highest-precision placement system in its class. Aiming at today’s and future placement demands, NANO enables the reliable handling of ultra-small and very thin dies.

In a footprint of only 2.23 by 1.0 meters (7.3 by 3.3 feet), the new SIPLACE TX micron can place up to 96,000 cph with accuracy levels of up to 15 microns @ 3σ and placement distances of as little as 50 microns.

In the 4-mm module of the SIPLACE SmartFeeder Xi, the bottoms of the blister pockets can be vacuum-leveled to ensure that even the smallest components are positioned correctly.

The optional vacuum tooling makes it possible to operate with the highest placement precision of 15 microns @ 3σ.